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MIS MILL ETCH |
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Function & Features |
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- Using End mill for the milling of EMC
- Fast, safe, and accurate milling work
- Prompt and accurate milling by robot motions (Average milling time < 1 min.)
- Robot motion (X, Y, Z axis) having the precision of minimum 0.01mm (10㎛)
- Automatically recognizing the height of the sample surface through a sensor and doing the milling work
- Providing various sizes of end mills (Φ1.0, Φ2.0, Φ3.0 mm)
- Very effective for the removal of metal surface
- Reducing the molding (EMC) thickness, which makes the decapsulation work finished fast
- Providing the guide well for etching zones
- Backside milling which is effective for removing PCB and
molding |
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Specification |
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| Item |
Description |
| Dimension |
430(W) x 575(D) x 620(H) mm |
| Weight |
Approx. 80 kg |
| Procedure |
Milling |
| Handling IC Size |
2x2 mm ~ 80x80 mm (Minimum Milling Depth : Approx. 0.01 mm) |
| Cleaning System |
Vacuum Cleaner (Option) |
| Process Time |
1~2 min.(Average Time) |
| Utility |
Rated Voltage : AC 220V/110V, 1 Phase
Rated Current : 15A
Rated Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar) |
| Program |
Microprocessor Control Panel |
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